TBDSZ Mini 256/384/640 LWIR Micro Thermal Camera Module
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TBDSZ Mini 256/384/640 LWIR Micro Thermal Camera Module
Features of TBDSZ Mini 256/384/640 LWIR Micro Thermal Camera Module
1. TBDSZ Mini 256/384/640 LWIR Micro Thermal Camera Module adopts new self-developed 12μm VOx infrared detector and a custom ASIC infrared image processing chip.
(1) Features:
- Compact Size.
- Lighter Weight.
- Lower Power Consumption.
(2) Core Parameters:
- Resolution: 256×192
- Pixel size: 12μm
- Dimension: entire series 21*21 mm, <8 g
(3)Connection & Setup:
2. The 256 series of infrared modules achieve a size of 21*21 mm, meeting the application requirements of SWaP3 (Size, Weight and Power, Performance, Price).
(1) Autonomous core, cost-effective:
- The self-developed 12μm WLP infrared detectors in the 256/384/640 series offer excellent value for cost and are the optimal choice for the same resolution.
- The self-developed high-performance LY ASIC infrared image processing chip has completely independent core technology and supply.
(2) Outstanding performance, lightweight and convenient:
- Provide smooth and high-definition images, supporting up to 50Hz lossless image quality.
- Two precise temperature measurement modes cover a wide temperature range and ensure temperature stability in different ambient temperatures.
- The entire series has ultra-compact size of 21*21 mm, with a module body weighing less than 38g, making integration easy.
(3) Rich functions, multiple options:
- Lensless solutions, manual/auto-focus non-thermalized lenses cover various scenarios.
- Abundant Windows/Linux/Android SDK interfaces provide diverse functionality.
(4) APPLICATIONS:
- Industrial Temperature Measurement
- Power Detection
- Assisted Driving
- Personal wearables
- Drone
- Outdoor Night Vision
- Life Detection
Specifications of Mini 256/384/640 LWIR Micro Thermal Camera Module
Main Specifications | MINI 640 | MINI 384 | MINI 256 |
Detector Type | VOx infrared detector | ||
Resolution | 640×512 | 384×288 | 256×192 |
Detector Frame Rate | Imaging module: 50Hz; | 25Hz | |
Temperature measurement module: 25Hz; | |||
Pixel Pitch | 12μm | ||
Spectral Band | 8~14μm | ||
NETD | ≤50mK@25℃, F#1.0(≤40mK optional) | ||
Imaging Fuction | |||
Brightness Adjustment | 0~255, optional | ||
Contrast Adjustment | 0~255, optional | ||
Polarity | Black-hot/White-hot | ||
Palettes | Supported | ||
Digital Zoom | 0.25×~2.0× continuous zoom | ||
Mirroring | Horizontal/Vertical/Diagonal | ||
Reticle | Display/Blank/Move | ||
Image Processing | TEC-less algorithm | - | |
Non-uniformity correction | |||
Digital filter noise reduction | |||
Digital detail enhancement | |||
Module Power Supply | |||
Service Voltage | 3.3V, 5V dual power supply | ||
Typical Power Consumption @ 25ºC | <0.55W | <0.50W | <0.30W |
Module Output and Communication Interface | |||
Digital Video | DVP/BT656 | DVP/SPI | |
Communication Interface | I2C | ||
Expansion Board and Optional Interfaces | |||
Power Supply | 5V | ||
Power Protection | Support overvoltage, undervoltage, and reverse connection protection | ||
Output and Control Interfaces | USB2.0+I²C image output, providing Linux/Windows/Android SDK | ||
Physical Characteristics of Module | |||
Lens | Without lens/fixed focus/manual focusing | ||
Weight | <8 g | ||
Dimension | 21mm×21mm | ||
Temperature Measurement | |||
Temperature Measurement Functions | Target temperature -20°C~+150°C: Accuracy ±2°C or ±2% of reading (whichever is greater, @-20°C~60°C ambient temperature) | ||
Target temperature 50°C~+550°C: Accuracy ±5°C or ±3% of reading (whichever is greater, @-20°C~60°C ambient temperature) | |||
Temperature Measurement Methods | Point, line, frame | ||
Environment Adaptability | |||
Operating Temperature | -40℃~+80℃ | ||
Storage Temperature | -50℃~+85℃ | ||
Humidity | 5%~95%, non-condensing | ||
Vibration | 6.06g, random vibration, all axes | ||
Impact | 80g, 4ms, final peak sawtooth wave, three axes, and six directions |
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